A New 3D Imaging Technique Integrating Ultrafast Compounding, Hadamard Encoding, and Reconfigurable Fresnel Lensing, demonstrated on a 128-Element, Crossed Electrode Endoscope

Katherine Latham, Christopher Samson, Jeffrey Woodacre, Eric Simpson, Roger Zemp, Jeremy A. Brown

Producción científica: Capítulo en Libro/Reporte/Acta de conferenciaContribución a la conferencia

1 Cita (Scopus)

Resumen

Crossed electrode arrays address some the challenges associated with 3D ultrasound imaging because of the significant reduction in the number of elements (2N vs. N2). However, creating a two-way focused 3D image in real-time is difficult with these arrays because azimuth and elevation dimensions cannot be beamformed at the same time. We have developed a new 3D imaging approach that uses the flexibility of bias sensitive substrates to create a high-quality elevation focus on a crossed electrode array. The principle behind this technique is to perform conventional compound imaging with an azimuth set of electrodes, while implementing a bias controllable elevation lens with an elevation set of electrodes. On transmit, the biases are chosen to mimic a Fresnel lens. Then, on receive, Hadamard coding is implemented along the elevation dimension. After decoding, we gain the RF data for each element across the elevation aperture even though there is effectively only one channel in that dimension. A 30MHz, 64x64 element crossed electrode relaxor array was fabricated on a semi-kerfed, electrostrictive substrate and was used to demonstrate the performance of the imaging technique. The -6dB beamwidths were simulated to be 155μm and 170μm in the azimuth and elevation direction respectively and the secondary lobe levels were suppressed below -50dB. Images were generated of a wire phantom to confirm the performance of the elevational focus with good agreement between simulation and experiment.

Idioma originalEnglish
Título de la publicación alojada2019 IEEE International Ultrasonics Symposium, IUS 2019
EditorialIEEE Computer Society
Páginas2052-2055
Número de páginas4
ISBN (versión digital)9781728145969
DOI
EstadoPublished - oct. 2019
Evento2019 IEEE International Ultrasonics Symposium, IUS 2019 - Glasgow, United Kingdom
Duración: oct. 6 2019oct. 9 2019

Serie de la publicación

NombreIEEE International Ultrasonics Symposium, IUS
Volumen2019-October
ISSN (versión impresa)1948-5719
ISSN (versión digital)1948-5727

Conference

Conference2019 IEEE International Ultrasonics Symposium, IUS 2019
País/TerritorioUnited Kingdom
CiudadGlasgow
Período10/6/1910/9/19

Nota bibliográfica

Publisher Copyright:
© 2019 IEEE.

ASJC Scopus Subject Areas

  • Acoustics and Ultrasonics

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