Transducer fabrication using a 355nm pulsed picosecond laser - Rapid prototyping of 40 Mhz composites, custom electrode patterns, and circularly symmetric curvable composite patterns

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Resumen

In this work, a 355 nm pulsed picosecond laser dicing system is used to cut a 40 MHz 1-3 composite, an 11.6 MHz circularly symmetric 1-3 composite, and create custom electrode fanouts and element sub-dices for a 40 MHz phased array. The kerfs for the 40 MHz, composite, measuring 42 mumathrm{m} thick, were measured to be 3.2 mumathrm{m} and the pillars 15.8 mumathrm{m} square. kt was found to be 0.43 under no bias and 0.47 with a DC bias. The circularly symmetric composite shows a kt of 0.62 but contains spurious acoustic modes within the operating band which could be accounted for in the future by adjusting pillar spacing or changing epoxy filler. The circular composite has pillars designed to be 50 mumathrm{m} square, with kerfs of 30 mumathrm{m}. Total thickness is 148 mumathrm{m} which results in an 11.68 MHz resonance. A phased array electrode pattern was defined on a piezoelectric substrate with a fan-out geometry for electrical interconnect. This pattern contained features measuring less than 3 um in width. This array was subsequently kerfed fully through the piezoelectric substrate as well as sub-diced starting from within the array element.

Idioma originalEnglish
Título de la publicación alojadaIUS 2020 - International Ultrasonics Symposium, Proceedings
EditorialIEEE Computer Society
ISBN (versión digital)9781728154480
DOI
EstadoPublished - sep. 7 2020
Evento2020 IEEE International Ultrasonics Symposium, IUS 2020 - Las Vegas, United States
Duración: sep. 7 2020sep. 11 2020

Serie de la publicación

NombreIEEE International Ultrasonics Symposium, IUS
Volumen2020-September
ISSN (versión impresa)1948-5719
ISSN (versión digital)1948-5727

Conference

Conference2020 IEEE International Ultrasonics Symposium, IUS 2020
País/TerritorioUnited States
CiudadLas Vegas
Período9/7/209/11/20

Nota bibliográfica

Publisher Copyright:
© 2020 IEEE.

ASJC Scopus Subject Areas

  • Acoustics and Ultrasonics

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