Compensating for Tissue Changes in an Ultrasonic Power Link for Implanted Medical Devices

Hugo Vihvelin, Jeff Leadbetter, Manohar Bance, Jeremy A. Brown, Robert B.A. Adamson

Résultat de recherche: Articleexamen par les pairs

20 Citations (Scopus)

Résumé

Ultrasonic power transfer using piezoelectric devices is a promising wireless power transfer technology for biomedical implants. However, for sub-dermal implants where the separation between the transmitter and receiver is on the order of several acoustic wavelengths, the ultrasonic power transfer efficiency (PTE) is highly sensitive to the distance between the transmitter and receiver. This sensitivity can cause large swings in efficiency and presents a serious limitation on battery life and overall performance. A practical ultrasonic transcutaneous energy transfer (UTET) system design must accommodate different implant depths and unpredictable acoustic changes caused by tissue growth, hydration, ambient temperature, and movement. This paper describes a method used to compensate for acoustic separation distance by varying the transmit (Tx) frequency in a UTET system. In a benchtop UTET system we experimentally show that without compensation, power transfer efficiency can range from 9% to 25% as a 5 mm porcine tissue sample is manipulated to simulate in situ implant conditions. Using an active frequency compensation method, we show that the power transfer efficiency can be kept uniformly high, ranging from 20% to 27%. The frequency compensation strategy we propose is low-power, non-invasive, and uses only transmit-side measurements, making it suitable for active implanted medical device applications.

Langue d'origineEnglish
Numéro d'article7115976
Pages (de-à)404-411
Nombre de pages8
JournalIEEE Transactions on Biomedical Circuits and Systems
Volume10
Numéro de publication2
DOI
Statut de publicationPublished - avr. 2016

Note bibliographique

Funding Information:
This work was supported by an NSERC/CIHR Collaborative Health Research Grant.

Publisher Copyright:
© 2015 IEEE.

ASJC Scopus Subject Areas

  • Biomedical Engineering
  • Electrical and Electronic Engineering

PubMed: MeSH publication types

  • Journal Article
  • Research Support, Non-U.S. Gov't

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