Résumé
Typical high-frequency ultrasound resolution of 30-100 μm can be achieved in soft tissue over a penetration depth of 10-20 mm. The short penetration depth and high resolution, make high-frequency ultrasound particularly suitable for use in guided endoscopic surgery. In these minimally invasive procedures, a set of surgical instruments are inserted into a small incision site along with a set of imaging tools, typically endoscopic optical cameras and light sources. The entire surgical procedure is done solely under image guidance. Such an approach has become standard of care for a very large number of surgical procedures including those of the brain, colon, pancreas, uterus, bowel, etc. Recently, our group has developed a high-frequency array-based forward-looking ultrasound endoscope, that is suitable for guiding endoscopic procedures and providing depth resolved information. The packaged form factor for this imaging array has been miniaturized down to just a few millimetres, and the imaging performance has been characterized on ex-vivo and in-vivo tissues. A summary of the latest high frequency technology will be first be presented followed by a detailed performance characterization of our group's endoscope in combination with our high frame-rate high-frequency electronic beamformer. Future and prototype versions of high-frequency array transducers in-development will be discussed that incorporate 3D volumetric imaging, shear wave elastography, and co-registered histotripsy.
Langue d'origine | English |
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Titre de la publication principale | 2017 IEEE International Ultrasonics Symposium, IUS 2017 |
Maison d'édition | IEEE Computer Society |
ISBN (électronique) | 9781538633830 |
DOI | |
Statut de publication | Published - oct. 31 2017 |
Événement | 2017 IEEE International Ultrasonics Symposium, IUS 2017 - Washington, United States Durée: sept. 6 2017 → sept. 9 2017 |
Séries de publication
Prénom | IEEE International Ultrasonics Symposium, IUS |
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Volume | 0 |
ISSN (imprimé) | 1948-5719 |
ISSN (électronique) | 1948-5727 |
Conference
Conference | 2017 IEEE International Ultrasonics Symposium, IUS 2017 |
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Pays/Territoire | United States |
Ville | Washington |
Période | 9/6/17 → 9/9/17 |
Note bibliographique
Publisher Copyright:© 2017 IEEE.
ASJC Scopus Subject Areas
- Acoustics and Ultrasonics