Project Details
Description
3D-IC; analog integrated circuits; calibration; clock skew; CMOS; crosstalk; IC stacking; low power; mixed-signal integrated circuits; Through silicon via (TSV)
| Status | Active |
|---|---|
| Effective start/end date | 1/1/21 → … |
Funding
- Natural Sciences and Engineering Research Council of Canada: US$36,175.00
ASJC Scopus Subject Areas
- Electrical and Electronic Engineering