Détails sur le projet
Description
3D-IC; analog integrated circuits; calibration; clock skew; CMOS; crosstalk; IC stacking; low power; mixed-signal integrated circuits; Through silicon via (TSV)
| Statut | Actif |
|---|---|
| Date de début/de fin réelle | 1/1/21 → … |
Financement
- Natural Sciences and Engineering Research Council of Canada: 36 175,00 $ US
ASJC Scopus Subject Areas
- Electrical and Electronic Engineering