Detalles del proyecto
Description
3D-IC; analog integrated circuits; calibration; clock skew; CMOS; crosstalk; IC stacking; low power; mixed-signal integrated circuits; Through silicon via (TSV)
| Estado | Activo |
|---|---|
| Fecha de inicio/Fecha fin | 1/1/21 → … |
Financiación
- Natural Sciences and Engineering Research Council of Canada: US$ 36.175,00
ASJC Scopus Subject Areas
- Electrical and Electronic Engineering